The Union Cabinet, chaired by Prime Minister Narendra Modi, on Wednesday cleared a semiconductor unit under its ambitious India Semiconductor Mission. The chip unit will be set up in the upcoming Jewar Airport (Noida International Airport) in Uttar Pradesh. The project is in tandem with the nation’s broader goal of achieving a self-sufficient semiconductor ecosystem.
The semiconductor facility will be established at a total estimated investment of Rs 3,706 crore.
#Cabinet approves one more semiconductor unit under India Semiconductor Mission, a joint venture of HCL and Foxconn, be set up near Jewar airport#CabinetDecisions pic.twitter.com/QVCIvR0Mb1
— Dhirendra Ojha (@DG_PIB) May 14, 2025
Meanwhile, India is targeting to achieve a 10 per cent market share in semiconductors globally by 2030.
The chips produced at this facility will be used in a diverse array of industries including mobile phones, laptops and automobiles.
The unit will have a capacity of 20,000 wafers and 3.6 crore chips per month, with production expected to commence in 2027.
This marks Foxconn’s second attempt to enter the Indian market.
While HCL has a long history of developing and manufacturing hardware, Foxconn is a global major in electronics manufacturing.
The plant will be located in the Yamuna Expressway Industrial Development Authority (YEIDA).
Union Minister Ashwini Vaishnaw confirmed that work on the country’s other five units is underway. All five facilities—spread across Gujarat and Assam—are expected to be inaugurated this year, he said.
With the demand for semiconductor increasing with the rapid growth of laptop, mobile phone, server, medical device, power electronics, defence equipment, and consumer electronics manufacturing in Bharat, this new unit will further add to the country’s Atmanirbhar Bharat vision.
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